| abstract |
PROBLEM TO BE SOLVED: To provide a microelectronic cleaning composition for cleaning a microelectronic substrate, particularly silicon dioxide, a high-sensitivity low-κ and high-κ dielectric, and copper, tungsten as well as an Al or Al (Cu) metal-coated substrate. Featuring tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin, and other metal coatings and advanced interconnect techniques. Cleaning compositions useful for their cleaning are provided that have improved compatibility with microelectronic substrates. A microelectronic cleaning composition comprising halogen oxyacids, their salts and derivatives is used. [Selection figure] None |