| abstract |
PROBLEM TO BE SOLVED: To provide a resin system in which an inorganic filler is highly filled, and does not require a newly added low molecular weight component for improving the fluidity of the resin, and the prepregs are within a wide range of fluidity management An object of the present invention is to provide a prepreg capable of improving the adhesiveness between the layers and improving the soldering heat resistance, a laminate including the prepreg, and a method for producing the same. SOLUTION: A prepreg in which a reinforcing material is impregnated with a resin, wherein two or more prepregs each having a through-hole and a prepreg containing the reinforcing material and the resin are stacked, and a metal foil is disposed on one side or both sides thereof. A laminate obtained by heating and pressing, wherein the prepreg has a hole penetrating in the thickness direction of the reinforcing material, and the penetrating hole is filled with the resin. It is. [Selection figure] None |