| abstract |
To provide a low dielectric loss resin composition having excellent dielectric properties and giving a cured product having excellent physical strength. Moreover, the electronic component which can respond to the high frequency signal using it is provided. A thermosetting low dielectric loss resin composition comprising a mixture of a polyfunctional styrene compound having a crosslinking component and a thermosetting polyphenylene ether copolymer containing an unsaturated bond at the side chain and terminal of the polyphenylene ether resin. Products, prepregs, laminates, and electronic components using them. [Selection figure] None |