| abstract |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent flame retardancy and moisture resistance without containing a halogen compound and having excellent alkali solubility, developability and solvent resistance and excellent physical property balance. Another object of the present invention is to provide a dry film resist using the photosensitive resin composition, and a printed wiring board using the dry film resist. (A) A cyclic phenoxyphosphazene compound having at least one phenolic hydroxyl group in one molecule, (B) polyamic acid, A photosensitive resin composition comprising (C) (meth) acrylate and (D) a photoreaction initiator as essential components. [Selection figure] None |