| abstract |
An object of the present invention is to provide a thermosetting composition for optical semiconductors, which has high transparency, does not cause discoloration due to heat generation or light emission of a light emitting element, has excellent heat resistance, has excellent light resistance, and has excellent adhesion to housing materials, etc. Encapsulant for optical semiconductor element, die bond material for optical semiconductor element, thermosetting composition for optical semiconductor, encapsulant for optical semiconductor, die bond material for optical semiconductor element and / or optical semiconductor element An optical semiconductor element using an underfill material for use is provided. A thermosetting composition for an optical semiconductor containing a silicone resin containing an epoxycyclohexyl group, an acid anhydride, and a phosphine oxide. [Chemical 1] [Selection figure] None |