| abstract |
A multilayer die bond sheet, a semiconductor device, and a method for manufacturing the semiconductor device capable of manufacturing a semiconductor device having a reduced area and a reduced thickness with excellent productivity. An adhesive film for a semiconductor having a resin layer A, a lead frame bonded to one side of the resin layer A of the adhesive film for semiconductor, a die bond sheet on the resin layer A of the semiconductor adhesive film through an opening of the lead frame A semiconductor device comprising: a semiconductor element bonded using a wire, a wire connecting the semiconductor element and an inner lead of a lead frame, and a semiconductor element and a sealing material sealing the wire. [Selection] Figure 1 |