http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008103622-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2804 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1163 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5571935f8ed14902cd88321e46cc087d |
| publicationDate | 2008-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008103622-A |
| titleOfInvention | Laminated body for producing printed wiring board and method for producing printed wiring board using the same |
| abstract | A laminate suitable for a printed wiring board capable of easily forming a conductive layer having excellent adhesion to an insulating film and small irregularities at the interface with the insulating film on an arbitrary solid surface, and using the same Provided is a printed wiring board having high-definition wiring having excellent adhesion to an insulating film on a substrate formed in this manner. A laminate suitable for a printed wiring board comprising at least (A) a reactive polymer precursor layer and (B) an insulating resin composition layer on a support. It is preferable that (A) the polymer precursor layer contains a polymerizable compound, and (B) the insulating film contains a polymerization initiator. A printed wiring board can be obtained by forming a graft polymer on the surface of this laminate and then providing a conductive layer there. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004287267-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022118629-A1 |
| priorityDate | 2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.