| abstract |
A transparent sealing material and adhesive that can be cured by a condensation reaction, have excellent transparency and heat resistance, and also have excellent heat stability, hardness (curability), and adhesion to a substrate. A resin composition suitable for light-emitting diode device processing is provided. The resin composition of the present invention comprises an acrylic resin, a condensation-reactive silicone compound and / or a condensation-reactive silane compound, and a curing accelerator, and the condensation-reactive silicone compound and the condensation reaction with respect to 100 parts by weight of the acrylic resin. The total content of the functional silane compound is 250 to 2000 parts by weight. [Selection figure] None |