| abstract |
The present invention provides a resin composition for encapsulating a semiconductor which is excellent in solder resistance, flame resistance and fluidity, and excellent in moisture resistance reliability or low warpage. An epoxy resin (A) represented by the general formula (1), a compound (B) containing two or more phenolic hydroxyl groups, an inorganic filler (C), a curing accelerator (D), A resin composition for encapsulating a semiconductor, comprising: (In the general formula (1), R1 is a hydrocarbon group having 1 to 20 carbon atoms and may be the same or different. R2 is an alkyl group having 1 to 4 carbon atoms. N1 is 0 to 5 carbon atoms. (It is an integer, and the overall average value is 0 or a positive number smaller than 5. m1 is an integer of 0 to 6.) [Selection figure] None |