| abstract |
An object of the present invention is to eliminate the misalignment due to the unevenness of the element to increase the yield, and to eliminate the decrease in the ESR value caused by the protruding or spreading of the conductive adhesive when the capacitor element is laminated. The shape of the current collecting lead frame used in manufacturing the multilayer solid capacitor is devised, and the pocket type lead frame, in particular, (1) the wall portion and the side wall in the bent structure of the drawer portion are cooperated. Forming a square wall structure at the corner of the capacitor element mounting surface, or (2) by providing a side wall partly on the capacitor element mounting surface and changing the height of the side wall depending on the part, resulting in unevenness of the element Provided is a solid electrolytic capacitor with high stacking efficiency and low ESR, which suppresses stacking misalignment and the sticking and spreading of the bonding conductor during stacking. [Selection figure] None |