| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-14 |
| filingDate |
2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5a54a96d925d55d9e3cc04346364d4e |
| publicationDate |
2008-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008085108-A |
| titleOfInvention |
Junction structure and electronic device |
| abstract |
PROBLEM TO BE SOLVED: To provide an electronic device having high solder fluidity and high temperature cycle reliability when soldering a base and a lid of an electronic device using solder not containing lead, and the electronic device is an external electric circuit board. To provide a package and an electronic device that can maintain the hermeticity of the electronic device even when a thermal history of 250 to 260 ° C. is applied during mounting. A base plate, a metal layer that contains Ni and Co, has a first melting point, and is formed on the surface of the metal layer. The first solder layer 3a includes a second solder layer 3b having a second melting point higher than the first melting point and formed on the surface of the first solder layer 3a. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101731942-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5853702-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103262194-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2473285-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102248241-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013219237-A |
| priorityDate |
2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |