| abstract |
The present invention provides an epoxy resin for sealing that has excellent solder heat resistance and does not cause cracking or peeling even when applied to a surface mount package, and uses thereof. The sealing epoxy resin composition of the present invention can be composed of a sealing epoxy resin represented by the following formula (1) and a curing agent, and may contain an inorganic filler. [Chemical 1] (Wherein ring Z 1 and ring Z 2 are aromatic hydrocarbon rings, R 1a and R 1b are alkylene groups, R 2a , R 2b , R 3a and R 3b are substituents such as alkyl groups and phenyl groups, m 1 and m 2 are integers of 1 to 3, n 1 and n 2 are integers of 1 to 10, p 1 and p 2 are integers of 0 to 5, q 1 and q 2 are integers of 0 to 4) [Selection figure] None |