| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d437b2abb428aeb59000da0b15dc2f98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-1535
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate |
2006-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af3e9087414fe00500c646c4e1dc903e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_364051bec426eb2ba62f1709139b69a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6e4742b30c259adbe2b1e5377cada7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc8d038c32fc8bbd7840a5c293809b6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99b33f9d5352993e01016a213adc6623 |
| publicationDate |
2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008062253-A |
| titleOfInvention |
Soldering flux and solder paste composition |
| abstract |
PROBLEM TO BE SOLVED: To provide a soldering flux and a solder paste composition capable of exhibiting good wettability with respect to a metal not containing lead or plating regardless of the metal type. A soldering flux of the present invention is a flux comprising a base resin and an activator, and contains an oxygen-containing heterocyclic compound having at least one carboxyl group in the molecule as the activator. To do. The oxygen-containing heterocyclic compound preferably has a five-membered ring structure selected from the group consisting of furan, hydrofuran and oxazole. Moreover, it is preferable that content of the said oxygen-containing heterocyclic compound is 0.1 to 50 weight% with respect to the flux total amount. The solder paste composition of the present invention contains the flux of the present invention and a solder alloy powder. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101347875-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017507025-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015112617-A |
| priorityDate |
2006-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |