| abstract |
PROBLEM TO BE SOLVED: To provide a heat radiating substrate with a more excellent heat radiating property, high voltage resistance, dielectric insulation, and a flexible mechanical structure. A heat dissipation substrate for an electronic device includes a first metal layer, a second metal layer, and a thermally conductive polymer dielectric insulating layer. An LED is mounted on the surface of the first metal layer 21. A thermally conductive polymer dielectric insulating layer 23 is laminated between the first metal layer 21 and the second metal layer 22 in a manner in direct contact with the first metal layer 21 and the second metal layer 22, and between them. Includes at least one micro-concave surface having a surface roughness (Rz) greater than 7.0. There are many nodular protrusions on the surface of the minute irregularities, and the particle diameter of the nodular protrusions is mainly in the range of 0.1 to 100 μm. The heat conductivity of the heat dissipation substrate 20 is greater than 1 W / m · K, the thickness is less than 0.5 mm, and (1) 30 to 60% by volume of a fluorine-containing polymer having a melting point higher than 150 ° C. ( 2) 40-70% by volume of a thermally conductive filler dispersed in the fluorine-containing polymer. [Selection] Figure 1 |