http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008055456-A

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filingDate 2006-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f72a4c9d3e45de66642c80fc529b1bbb
publicationDate 2008-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008055456-A
titleOfInvention Soldering method and laser device for soldering
abstract A soldering method and the like capable of performing soldering of a minute size are provided. A soldering method according to the present invention is a method of performing soldering by irradiating a solder or an object to be soldered with laser light, and having a single core and optically amplified light in a single mode. An amplification optical fiber 14 to be output and a seed light source 12 to output seed light to be input to the amplification optical fiber 14, and the seed light output from the seed light source 12 is optically amplified and output by the amplification optical fiber 14. From the fiber laser device 10, the fiber laser device 10 and the spatial optical system 30 that collimates the output light from the fiber laser device 10, condenses it with a condensing lens, and irradiates the solder or the soldering object. The output light is output as light having a pulse width of microseconds or more or continuous light, and the output light from the spatial optical system 30 is irradiated onto the solder or the soldering object. [Selection] Figure 1
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