| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9df90d7822cc480ce12c480f4089e229
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cf1c23106eec7fd71584cbe5b3948b1e |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D13-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
| filingDate |
2006-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2000ad4dfa6f8dd659e6a01391193d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_233f2779a45aecdedd64085efd03626b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ee8d20357ad55338ec18baabd01244a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eae40432ca2219a27cc3e8067aa81d26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3c2b3db04de5830ee8f801cbe91e548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0159615a3af55e7d73ead332320a50cc |
| publicationDate |
2008-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008050634-A |
| titleOfInvention |
Electrodeposited polyimide thin film and method for forming the same |
| abstract |
SOLUTION: A film is formed by electrodeposition from a polyimide electrodeposition solution which is an aqueous solution of a polyimide compound selected from a polyimide precursor having a carboxyl group in the molecular structure and an anionic polyimide or a mixed solvent solution of water and an organic solvent. A polyimide thin film that is ionized by an electrode reaction during electrodeposition and dissolved in the polyimide electrodeposition solution is used as an anode, and an electrode is formed on the substrate upon electrodeposition. An electrodeposited polyimide thin film formed through a metal layer or a metal compound layer that is ionized by reaction and does not dissolve in the polyimide electrodeposition solution, and a method for forming the same. [Effect] It is possible to provide an electrodeposited polyimide thin film excellent in adhesion formed on a conductive metal such as Cu. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104878433-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009246246-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020059689-A1 |
| priorityDate |
2006-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |