http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008050545-A

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filingDate 2006-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e9225b2430cd1b4b1a101a7709a5171
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publicationDate 2008-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008050545-A
titleOfInvention Epoxy resin composition for optical semiconductor encapsulation and optical semiconductor device
abstract Disclosed is an epoxy resin composition for encapsulating an optical semiconductor that does not lose transparency even when exposed to a high temperature or ultraviolet irradiation for a long time after curing, and can obtain sufficient durability. The present invention relates to an epoxy resin composition for optical semiconductor encapsulation, which contains (A) an epoxy resin, (B) a curing agent, and (C) a curing accelerator as essential components. As the component (A), (A-1) a hydrogenated epoxy resin having a molecular weight of 800 or more obtained by hydrogenating an aromatic epoxy resin and (A-2) triglycidyl isocyanurate are used. (B) An acid anhydride is used as a component. 5-50 mass% of (A-1) components and 5-20 mass% of (A-2) components are contained with respect to the epoxy resin composition for optical semiconductor encapsulation. [Selection figure] None
priorityDate 2006-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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