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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
filingDate 2006-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dbf573964164aea3e7938cc775f27fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acd6f34d08c35cf74e6810adeb7b2b43
publicationDate 2008-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008045156-A
titleOfInvention Surface treatment agent and treatment method for copper or copper alloy surface
abstract Disclosed is a copper or copper alloy treating agent capable of ensuring sufficient adhesion between a surface of a copper or copper alloy comprising a vapor deposition layer or an electroless plating layer and a photosensitive resin (photoresist). In order to solve this problem, the present invention provides the following formula: (In the formula, R 1 to R 4 each independently represent a nitrogen atom or a carbon atom. Here, when at least one of R 1 to R 4 represents a carbon atom, the hydrogen held by the carbon atom is In addition, R 1 and R 2 and / or R 3 and R 4 may form a condensed ring together with other carbocycles or heterocycles. The carbocycle or heterocycle in this case may have a lower alkyl group as a substituent. The surface treatment agent for copper or copper alloy which consists of the aqueous solution which contains 1 or more types of heterocyclic compounds represented by these, and is pH 4 or less is provided. [Selection figure] None
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