http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008041801-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36d1d9c59848bff6ad5f55923d1290f5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
| filingDate | 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_556800313609da54ac320edd47c6482e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6743ab428d9af93282c81651dc838cd7 |
| publicationDate | 2008-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008041801-A |
| titleOfInvention | Semiconductor device |
| abstract | A process margin can be increased to improve the quality and reliability of a semiconductor device. In a SIP 10 in which a semiconductor chip 1, an interposer substrate 2 and a semiconductor chip 3 are laminated on a wiring substrate 7, a part of an upper stud bump 2d of the semiconductor chip 1 is formed in a through hole 1e of the semiconductor chip 1. Since the through hole 1e is embedded inside and opens to the outside of the bonding portion 1f of the first electrode pad 1c, it is possible to sufficiently transmit ultrasonic vibration during stud bump bonding. As a result, the stud bump connection that reduces the defective shape and peeling of the stud bump 1d can be secured, the process control when forming the through hole 1e by laser processing or etching processing becomes easy, and the process margin is increased. be able to. [Selection] Figure 3 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10681256-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I418265-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017204891-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9831011-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11153471-B2 |
| priorityDate | 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452198021 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57420512 |
Total number of triples: 21.