http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008040184-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 |
| filingDate | 2006-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93c73d832f83b05a2bba1832f671c118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98f013b9fbfadcb1479fd616f0a75342 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7fe6fc5328d4c216481d3d3a3025024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80590cbed73651cedecb20ca3695cf4c |
| publicationDate | 2008-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008040184-A |
| titleOfInvention | Photosensitive resin composition for interlayer insulation film |
| abstract | Provided is a photosensitive resin composition for an interlayer insulating film which can use a general-purpose developer and has a reduced film thickness of a formed pattern. An application step of applying a photosensitive resin composition onto a substrate, an exposure step of selectively exposing the photosensitive resin composition after application, and a development step of developing with an alkaline developer after the exposure. A photosensitive resin composition for an interlayer insulating film, comprising: (A) an alkali-soluble resin component; and (B) a photosensitive agent, wherein the (A) alkali The soluble resin component contains a copolymer (A1) containing an acidic group-containing structural unit (a1) and a crosslinkable group-containing structural unit (a2), and the (B) photosensitizer is a quinonediazide group-containing compound, In the development step, the value of the dissolution rate of the exposed part / the dissolution rate of the unexposed part when developing with a 2.38 mass% tetramethylammonium hydroxide aqueous solution is 5 or more. [Selection figure] None |
| priorityDate | 2006-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 373.