| abstract |
There are few inks for forming a conductive film capable of forming a conductive film excellent in adhesion with an electrical insulator layer containing polyimide, and few printed wiring boards having a conductive film excellent in adhesion with an electrical insulator layer containing polyimide. A method of manufacturing a printed wiring board that can be manufactured in a process is provided. A water-insoluble organic solvent having a boiling point of 150 to 350 ° C. under a pressure of 0.1 MPa, metal fine particles and / or metal hydride fine particles dispersed in the organic solvent, and according to the provisions of JIS K7237 A conductive film forming ink containing an amino compound having an amine value of 10 to 190 mgKOH / g is applied to the surface of the electrical insulator layer 12 to form a coating film, and the coating film is baked to form the conductive film 14. Form. [Selection] Figure 1 |