| abstract |
An object of the present invention is to provide a positive photosensitive resin composition having excellent properties such as high resolution and high sensitivity and good stability. (A) A hydroxyl group contained in a polyimide precursor or a polyoxazole precursor has a general formula (I) Embedded image (Wherein R 1 , R 2 and R 3 are the same or different and each represents a substituted or unsubstituted alkyl, a substituted or unsubstituted aryl, a substituted or unsubstituted aralkyl, etc., and R 2 and R 3 are A resin substituted with a group represented by the following: (B) a compound capable of generating an acid upon irradiation with radiation or active energy rays A positive photosensitive resin composition comprising: [Selection figure] None |