| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having high flame resistance without using a flame retardant, excellent moldability, particularly continuous moldability, package appearance, and solder resistance, and curing thereof. To provide an electronic component device in which an element is sealed with an object. (A) An epoxy resin containing a phenol aralkyl type epoxy resin (a1) having a phenylene skeleton, (B) a phenol resin curing agent containing a phenol aralkyl type phenol resin (b1) having a biphenylene skeleton, C) an organopolysiloxane having a carboxyl group (c1) and / or a reaction product of an organopolysiloxane having a carboxyl group (c1) and an epoxy resin (c2), (D) a tolylene diisocyanate-modified oxidized wax, and (E) An epoxy resin composition for sealing, comprising an inorganic filler, wherein the content of the inorganic filler in the total epoxy resin composition is 84% by weight or more and 92% by weight or less. [Selection] Figure 1 |