| abstract |
【Task】 Excellent heat resistance, UV resistance, optical transparency, toughness, adhesiveness, and a cured product with high refractive index and improved light extraction efficiency from semiconductor light emitting devices. A resin composition for sealing a device is provided. [Solution] (A) Average composition formula: R 1 a (OX) b SiO (4-ab) / 2 (In the formula, R 1 is independently an alkyl group, alkenyl group or aryl group having 1 to 6 carbon atoms, and X is independently a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group or an alkoxy group. An alkyl group or an acyl group, a is a number of 1.00 to 1.5, b is a number of 0 <b <2, provided that 1.00 <a + b <2. An organopolysiloxane having a polystyrene-reduced weight average molecular weight of 3 × 10 3 or more, (B) A resin composition for sealing an optical device containing an aluminum chelate compound and (c) a metal oxide sol fine particle. [Selection figure] None |