| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2006-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_012ec004626fd156721b77c67965426c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afee2551a3c7150556fd318894579d56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096e79fe344855559ec13ac6997d4bbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e87c5d9cf2871dd97e10d1998b9e31aa |
| publicationDate |
2008-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008007561-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| abstract |
[PROBLEMS] To provide a high fluidity even in a high filling with an inorganic filler, especially in the formation of a thin semiconductor package among semiconductor packages, and to suppress the occurrence of a wire flow during the molding and to have an excellent moldability. An epoxy resin composition for semiconductor encapsulation is provided. An epoxy resin composition for semiconductor encapsulation containing the following (A) to (D). (A) Epoxy resin. (B) Phenolic resin. (C) Inorganic filler. (D) A mold release agent represented by the following general formula (1). [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010280804-A |
| priorityDate |
2006-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |