| abstract |
The present invention is excellent in heat resistance, and has a small weight change with respect to fluorine plasma, oxygen plasma and mixed plasma thereof exposed in a semiconductor manufacturing process. Provided are a fluorine-containing elastomer composition that gives a molded product that does not generate, and a sealing material comprising the composition. A fluorine-containing elastomer composition for a sealing material of a semiconductor production apparatus, comprising a fluorine-containing elastomer having at least one group selected from the group consisting of a cyano group, a carboxyl group and an alkoxycarbonyl group, and an organic filler. In a thermogravimetric analysis measured at 10 ° C./min in a nitrogen atmosphere, the organic filler is a filler having a 1% by weight reduction temperature of 300 ° C. or more, and the organic filler is a filler having a plasma aging resistance preventing effect. It is an elastomer composition. [Selection figure] None |