http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007537358-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61F2-06 |
| filingDate | 2005-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007537358-A |
| titleOfInvention | Electroplating solution for gold-tin eutectic alloy |
| abstract | The present invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally consists of water, stannous and / or stannic ions, complexing agents that confer solubility on the stannous and / or stannic ions, complexed gold ions, and ethoxy with phosphate ester functional groups. Alloy stabilizers containing fluorinated compounds, gloss additives based on ethoxylated phosphate esters and alkali metal fatty acid dipropionates. Brighteners can be used alone or in combination with each other to achieve a beneficial synergistic effect. The alloy stabilizer is present in an amount sufficient to stabilize the composition of the gold-tin deposit over the usable current density range. The solution has a pH of about 2-10, and the gold ions and the tin ions provide a deposit having a gold content of less than about 90 wt% and a tin content of greater than about 10 wt%. Present in a sufficient relative amount. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012087393-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016524048-A |
| priorityDate | 2004-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 134.