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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16
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filingDate 2004-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2007-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007531898-A
titleOfInvention Thinner composition for removing photosensitive resin
abstract The present invention relates to a photoresist removing thinner composition used in the manufacturing process of a semiconductor device or a liquid crystal display device, and more specifically includes a) propylene glycol monoalkyl ether; b) alkyl acetate; and c) cycloketone. The present invention relates to a thinner composition. The thinner composition of the present invention may further comprise a compound selected from the group consisting of d) a polyethylene oxide surfactant and e) a fluorinated acrylic copolymer. The thinner composition for removing a photoresist according to the present invention is unnecessarily attached to a glass substrate used for manufacturing a liquid crystal display element and an organic EL display element, and a peripheral edge and a back surface of a wafer used for semiconductor manufacturing. The photoresist can be efficiently removed in a short time, the interface step can be reduced, and the interfacial penetration phenomenon with respect to the photoresist can be particularly suppressed. Therefore, the present invention can be applied to various processes, and it is possible to simplify the manufacturing process and improve productivity as well as economical use.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014142635-A
priorityDate 2003-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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