| abstract |
The method of manufacturing an electronic component includes a liquid injection molding method for overmolding a semiconductor device. Liquid injection molding methods include: i) placing a semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, and iv) curable in the mold cavity. Injection molding the liquid and overmolding the semiconductor die onto the substrate, v) opening the mold and removing the product of step iv) and optionally vi) postcure the product of step v) Including. The semiconductor device may have an integrated circuit that is attached to the substrate by a die attach adhesive. |