http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007500632-A

Outgoing Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C43-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29D11-00
filingDate 2004-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2007-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007500632-A
titleOfInvention Wafer forming method for use in optical components and optical components incorporating such wafers
abstract An improved method is disclosed for forming a wafer into a complex curved shape for use in optical components. The method includes moving the wafer into contact with a mold surface having a predetermined non-cylindrical, non-spherical curved shape to form the wafer into a corresponding shape. This movement step itself forms the wafer into the desired non-cylindrical, non-spherical curved shape without any additional forming steps.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013525258-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101820990-B1
priorityDate 2003-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.