| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_386a14b6bf94e3f8b172391c0afef1f9 |
| publicationDate |
2007-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007335541-A |
| titleOfInvention |
Flexible printed circuit board and semiconductor device |
| abstract |
A flexible printed wiring board of the present invention has a wiring pattern formed by selectively etching an electrolytic copper foil layer of a base film in which a polyimide layer is formed on the surface of the electrolytic copper foil layer, A flexible printed wiring board that is used by bending the wiring pattern together with a polyimide layer, the wiring pattern including columnar copper crystal particles having a major axis length of 3 μm or more, a thickness of 15 μm or less, and an elongation of 5 at 25 ° C. % Of electrolytic copper foil. [Effect] The flexible printed wiring board of the present invention has excellent folding resistance. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009302427-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014501039-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011019080-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101396214-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016208609-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011023517-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011061186-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011165906-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011165750-A |
| priorityDate |
2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |