| abstract |
Provided are a wiring board having a metal post having high adhesion to a resin mold and having high long-term reliability, a semiconductor device using the wiring board having a metal post, a semiconductor device module, and a method for manufacturing the same. A wiring board includes a base body composed of at least one wiring layer and at least one insulating layer, and a plurality of metal posts provided on one surface of the base body. The at least one metal post 11 has at least one convex portion in the longitudinal cross-sectional shape, and at least one concave portion or convex portion in the cross-sectional shape in at least a part of the metal post 11 in the height direction. It has a deformed post. [Selection] Figure 1 |