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publicationDate 2007-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007320088-A
titleOfInvention Metal-clad board for prepreg and printed wiring board
abstract Provided are a prepreg and a metal-clad substrate for a printed wiring board that can exhibit excellent high-frequency characteristics expressed by a low dielectric constant and a low dielectric loss and high heat cycle resistance. A prepreg includes a sheet-like molded product (A) of a graft copolymer (a) and a resin-impregnated sheet-like fiber reinforced material obtained by impregnating a sheet-like fiber reinforcing material (b1) with a thermoplastic resin (b2). It is manufactured by thermocompression bonding with the material (B). The graft copolymer (a) is a random or block copolymer composed of a monomer unit of a nonpolar α-olefin monomer or a nonpolar conjugated diene monomer. It is obtained by graft polymerization of 15 to 40 parts by mass of the monomer. The thermoplastic resin (b2) is composed of 60 to 90% by mass of a monomer unit of a nonpolar α-olefin monomer or a nonpolar conjugated diene monomer and 10 to 40% by mass of an aromatic vinyl monomer unit. It is a random or block copolymer consisting of. [Selection figure] None
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