http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007320083-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2006-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c75f185b9506392b367ecd5d0d0c94cd |
| publicationDate | 2007-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007320083-A |
| titleOfInvention | Copper clad laminate |
| abstract | Kind Code: A1 Various printed wiring boards suitable for weight reduction, miniaturization, and high density of electronic products, among them, flexible laminates (also referred to as flexible printed wiring boards (FPCs), etc.) with good embeddability and bending resistance. It aims at providing the copper clad laminated board which can produce suitably. A copper-clad laminate comprising a copper foil provided on both sides of an insulating layer containing at least one polyimide layer, wherein the spring-back strength is 0.15 N or less. Laminated board. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014058620-A |
| priorityDate | 2006-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.