| abstract |
Provided are a light-curable resin composition that is suitable for insulating electronic components with low environmental impact, a light-curable moisture-proof insulating coating for mounting circuit boards, a highly reliable insulated electronic component, and a method for manufacturing the same. To do. A photocurable resin composition includes (A) (a1) a polyolefin polyol compound, (a2) an ethylenically unsaturated compound having a hydroxyl group, and (a3) a compound having two or more isocyanate groups in one molecule. A urethane compound having an ethylenically unsaturated double bond obtained by reacting with (B), a photopolymerizable monomer having an ethylenically unsaturated double bond and a heterocyclic structure, and (C) a photopolymerization initiator, and (D) A silane coupling agent having an isocyanate group is contained. [Selection figure] None |