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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D21H19-32
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filingDate 2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ac1e8afc552dffb8caea38abd7de7db
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publicationDate 2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007308865-A
titleOfInvention Silicone composition for peeling
abstract The release paper or release film is characterized by containing 50% or more of an organopolysiloxane represented by the general formula (1) and having at least two alkenyl groups in one molecule as the component (A). Addition-curable silicone composition capable of forming a mold coating layer. [Chemical 1] (A is an integer satisfying c ≦ a ≦ c + 2, b is 50 ≦ b ≦ 5000, c is 6 ≦ c ≦ b, d is 0, 1, 2 or 3, e is 0, 1 or 2, and f is 0 or 1 and R 1 is an alkenyl group, and R 2 is a monovalent hydrocarbon group containing no alkenyl group.) [Effect] The composition of the present invention is applied to paper, laminated paper, plastic film, etc. and cured by heating to form a cured film having a heavy peeling force against various adhesives. The formed cured film exhibits good adhesion to various substrates without reducing the adhesive strength of the adhesive. [Selection figure] None
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