http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007308796-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
filingDate | 2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f966847bcfa4265a47d47b360a5b804c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfedeba04c112ed3cf064fc29083534b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88335cf057289133df0a4d903ce395c4 |
publicationDate | 2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007308796-A |
titleOfInvention | Electroless gold plating solution and electroless gold plating method |
abstract | PROBLEM TO BE SOLVED: To provide an electroless gold plating solution that exhibits a sufficient deposition rate even at a low temperature, has a good film appearance, and has a particularly excellent plating solution stability. An electroless gold plating solution comprising a gold salt, a reducing agent represented by the following general formula (1), a heavy metal salt, and a polyethylene glycol compound. [In formula (1), R 1 represents a hydroxyl group or an amino group, and R 2 , R 3 and R 4 each independently represent a hydroxyl group, an amino group, a hydrogen atom or an alkyl group. ] [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10991590-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019501302-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018122989-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010077533-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190096420-A |
priorityDate | 2006-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 152.