http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007308601-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_50f9d52c04326083376d1a1f199b34cc |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2006-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9540b4d7f49acec1ae589dcf62fab5e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a47cfac5d992f95291ab6793fba06d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e318b1f2d714e01afa725ce626e4a4e7 |
| publicationDate | 2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007308601-A |
| titleOfInvention | Thermosetting epoxy resin composition |
| abstract | A thermosetting epoxy resin composition excellent in flexibility, impact resistance, and water resistance is provided. An epoxy resin containing as a main component a compound represented by the following general formula (1), obtained by reacting polyoxytetramethylene glycol and epihalohydrin, and having a total chlorine content of 0 as impurities. A thermosetting epoxy resin composition containing, as essential components, a flexible epoxy resin (A) and an acid anhydride curing agent (B) that are not more than 5% by weight is used. (N is an integer of 1 or more) [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101202028-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10822517-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008001758-A |
| priorityDate | 2006-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.