http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007300131-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
filingDate 2007-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e79df52b64bfbcf693fe228e8530427f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_686c548b2a828caaf974a3177d24c4df
publicationDate 2007-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007300131-A
titleOfInvention LSI wiring structure design method
abstract PROBLEM TO BE SOLVED: To provide an LSI wiring structure design method capable of reducing wiring capacitance C and wiring delay RC. An estimate the process variation amount and [delta] P, and sets the allowable value of variation in the interconnect delay Δ (RC) / (RC) and xi] RC, a fringe capacitance ratio from fringe capacitance C F and parallel-plate capacitor C P by evaluating F = C F / C P, the following equation F ≦ (1-δ P) · δ P / (δ P -ξ RC) - 1 The wiring structure is determined so as to satisfy the above. [Selection] Figure 1
priorityDate 1999-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 19.