| abstract |
A chip module and a chip card, each of which is more robust against mechanical and thermal stresses, and a method of manufacturing the same. A chip module includes a substrate 1 having a chip upper surface 2 and a contact upper surface 3 opposite to the chip upper surface 2, a chip 8 attached to the chip upper surface 2 of the substrate 1, and the substrate. A contact bank 4 formed on one of the contact upper surfaces 3, and at least one passage 6 formed on the substrate 1. [Selection] Figure 1 |