| abstract |
Provided is a multilayer printed wiring board that can be directly electrically connected to an IC chip without a lead component and that has high reliability. A corner portion of an IC chip incorporated in a multilayer printed wiring board is chamfered. Therefore, even when the multilayer printed wiring board is subjected to a heat cycle, stress does not concentrate at the corners of the IC chip. Therefore, in the vicinity of the corner portion, the core substrate 30 and the interlayer resin insulation layer 50, the IC chip and the interlayer resin insulation layer 50 are prevented from being peeled off, and the generation of cracks in the interlayer resin insulation layer 50 is prevented. Improve the reliability. [Selection] Figure 7 |