| abstract |
A semiconductor device and a manufacturing method of an SiP type capable of forming a buffer layer by contact printing and further realizing formation of an alignment mark that realizes automation of dicing for reducing manufacturing cost at a low cost. provide. A method of manufacturing a semiconductor device packaged including a semiconductor, wherein an insulating resin layer (16, 16) stacked on a substrate is formed in a semiconductor device formation region SD of the substrate divided by a scribe line SL. 20) and a rewiring layer (17, 18, 21, 23) embedded in the insulating layer are formed, and the substrate 10 is cut along the scribe line SL. Here, when the rewiring layer is formed, the alignment mark 23a used in the step of cutting the substrate is formed on the scribe line SL, and when the substrate 10 is cut, the substrate 10 is positioned with reference to the alignment mark 23a. Together, the substrate 10 is cut. [Selection] Figure 9 |