| abstract |
The present invention provides an electrical / electronic wiring connecting material that is superior in low-temperature fast curing properties and has a usable life compared to conventional epoxy resin-based connecting materials, and a method of manufacturing a wiring board using the same. With the goal. In the present invention, a wiring connecting material comprising 2 to 75 parts by weight of a polyurethane resin, 30 to 60 parts by weight of a radical polymerizable substance, and 0.1 to 30 parts by weight of a curing agent that generates free radicals upon heating. (15) and a wiring board manufacturing method using the same are provided. In addition, as for the wiring connection material (15) of this invention, it is desirable to contain a film formation material and / or electroconductive particle (14) further. [Selection] Figure 1 |