http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007287939-A

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filingDate 2006-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c98a595a992246340131cabd70775d6
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publicationDate 2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007287939-A
titleOfInvention Polishing method and polishing apparatus
abstract A chemical polishing end point detection technique that can quickly detect the generation of highly toxic gas associated with polishing and implement effective avoidance measures against the danger, and can be applied to an actual polishing process and polishing apparatus. A polishing method and a polishing apparatus for polishing are provided. In a polishing method in which a substrate to be polished W is pressed against a polishing surface 11a of a polishing table 11, and the substrate to be polished W is polished by relative movement of the substrate to be polished W and the polishing surface 11a, polishing of the polishing table 11 is performed. A gas suction pipe 52 for sucking gas is provided immediately above the surface 11a, and the atmospheric gas on the polishing surface 11a is sucked into the gas detector 53 from the gas suction port 52a of the gas suction pipe 52, and a specific component in the atmospheric gas Polish while monitoring the gas. [Selection] Figure 2
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