| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fb803942eb5124eaed79db3d775fad47 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0735 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0466
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07342
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2856
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2884
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2006-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29f900d2d5d46d874d2625c972501dbf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b219d02bc02c565c21fc6613e0da7c57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cab776d54407915774221986bee8346 |
| publicationDate |
2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007285800-A |
| titleOfInvention |
Flexible wiring board and electrical connection device |
| abstract |
The present invention provides a flexible wiring board capable of suppressing an increase in electrical resistance of an internal conductive path and increasing the mechanical strength of the conductive path. A flexible wiring board includes an insulating synthetic resin film having flexibility and a conductive path disposed on or in the film. The conductive path includes a laminated structure of a first conductive material layer and a second conductive material layer having higher toughness than the first conductive material layer. [Selection] Figure 4 |
| priorityDate |
2006-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |