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filingDate 2006-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c38fe661e019f34b591d30880d3870ca
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publicationDate 2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007284610-A
titleOfInvention Hot melt adhesive
abstract An object of the present invention is to provide an ethylene / (meth) acrylate copolymer copolymer hot melt adhesive composition that prevents stringing that occurs during coating with a nozzle and is excellent in heat and cold resistance adhesion. An ethylene / unsaturation having an unsaturated ester unit amount difference ΔX calculated by the following formula (1) of 19.5% by weight or more with respect to an ethylene / (meth) acrylic acid alkylate copolymer. It is a hot melt adhesive composition in which 0.05 to 3 parts by weight of the ester copolymer (D) is mixed. [Selection figure] None
priorityDate 2006-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 45.