| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 |
| filingDate |
2006-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bdf8ca01f264c43a953438390d72450 |
| publicationDate |
2007-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007268782-A |
| titleOfInvention |
Laminate |
| abstract |
Provided is a laminated body that is suppressed in warpage and has moisture resistance reliability and solder heat resistance required when used for a substrate such as a semiconductor circuit or an electronic circuit. A metal foil and an insulating layer formed of a photosensitive resin composition containing an alkali-soluble epoxy acrylate polymer resin having a weight average molecular weight of 1000 to 30000 as a main component of a resin component are laminated. Is a laminate. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012147745-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012147745-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018013807-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017013345-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011001485-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103492949-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102472970-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6134264-B2 |
| priorityDate |
2006-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |