| abstract |
An insulating composition that can be used for forming an insulating layer of a circuit board and that can be suitably produced using a conventional manufacturing method is provided. A first fluoropolymer having a first melting point, a second fluoropolymer having a second melting point lower than the first melting point, and a first having a first thermal conductivity. And a second inorganic filler having a thermal conductivity lower than the first thermal conductivity, and further a support member made of a glass fiber cloth. [Selection figure] None |