http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007265543-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B21-21 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2006-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5381c9071430791286671bc9e70aade http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48dc13c59e3a0332381c1f3d32c0e9a1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc7e20518603ea4df141071ad0b2bdc6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45c09e6574b3faf11017f872b11a0175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_168e393d8e0085674c9ca54bf7941041 |
| publicationDate | 2007-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007265543-A |
| titleOfInvention | Manufacturing method of laminate for HDD suspension |
| abstract | PROBLEM TO BE SOLVED: To improve the adhesion between the surfaces of an insulating resin layer and a conductor layer (copper foil) in view of the above-mentioned problems, can sufficiently meet the demand for microcircuits, and does not cause warping or the like in the laminate. The manufacturing method of the laminated body for HDD suspension which can be made. A method for manufacturing a laminate for an HDD suspension according to the present invention includes a first step of selecting a copper foil having a tensile strength of 500 MPa or more and an electric conductivity of 35% or more as a conductor layer, and thermoplasticity on one side of the copper foil. Low linear thermal expansion polyimide resin layer (B) having a linear thermal expansion coefficient of 1 × 10 −6 to 30 × 10 −6 (1 / K) on the surface to be the polyimide resin layer (A1) and resin layer (A1) The second step of laminating three or more polyimide resin layers of the thermoplastic polyimide resin layer (A2) on the surface to be the resin layer (B), and a stainless steel foil overlaid on the polyimide resin layer (A2), And a third step of thermocompression bonding under pressure. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009267042-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009184130-A |
| priorityDate | 2006-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.