http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007264646-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2007-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02602d7bf4a6b83c0a7c1feabedae8f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51fa0ce4d4abeeaeb492059877858d89 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99bdff9aa47d25894f4e6e415f25ea71 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50f4a97d049df833ff4c1ad182ea4d9a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad60b78d1616f3cba147e2333490c4a0 |
| publicationDate | 2007-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007264646-A |
| titleOfInvention | Resist pattern thickening material, resist pattern and manufacturing method thereof, and semiconductor device and manufacturing method thereof |
| abstract | PROBLEM TO BE SOLVED: To provide a resist pattern thickening material or the like capable of forming a surface layer having a thick resist pattern and forming a surface layer excellent in etching resistance and capable of miniaturizing the pattern. A resist pattern thickening material containing a resin, a crosslinking agent, and a cyclic structure compound, or a resin having a cyclic structure in part and a crosslinking agent. A resist pattern having a surface layer on the resist pattern and having an etching rate (Å / s) ratio (inner layer / surface layer) of 1.1 or more between the surface layer and the inner layer under the same conditions. A method for producing a resist pattern, wherein a resist pattern is formed and then the thickening material is applied to the surface of the pattern. A semiconductor device comprising: a step of forming a resist pattern on an underlayer; then, applying the thickening material to the pattern surface to increase the thickness of the pattern; and patterning the underlayer by etching using the pattern as a mask Manufacturing method. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8877634-B2 |
| priorityDate | 2001-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.